Study of Superconducting Equilateral Triangular Patch printed on Anisotropic Dielectric Substrates
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Date
2022
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IEEE Xplore
Abstract
The aim of this manuscript is the analysis of an equilateral triangular patch antenna (ETPA) based on superconducting patches using the cavity model and the electromagnetic knowledge in conjunction with the boundary conditions of the complex resistivity. The present method is chosen for the reason that, in contrast to precise techniques, it affords an improved qualitative thoughtful besides it requiring straightforward mathematical formulas. The obtained numerical results are presented for the dominant mode as well as the higher-order modes. A parametric study is carried out in order to study the influence of some physical and electrical parameters on the antenna performance taking in consideration the uniaxial anisotropy in the dielectric substrates. The obtained data of all the structures are evaluated with the calculated and measurement data mentioned in the literature.
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Agaba, C., Bedra, R., Bedra, S., Benkouda, S., & Fortaki, T. (2022, October). Study of Superconducting Equilateral Triangular Patch printed on Anisotropic Dielectric Substrates. In 2022 2nd International Conference on Advanced Electrical Engineering (ICAEE) (pp. 1-6). IEEE.